ECUs that are designed today need to have the performance and flexibility to run the workloads of the next decade.

The international standard has been proven effective in automotive functional safety and has begun to spread to other markets ...

SDVs are booming, but designing hardware that can run software updates a decade in the future is a huge challenge.

Global semi sales; 3rd CHIPS Act flagship; UFS and memory standards; Chinese military companies in U.S.; TSVs; CES; 18 new ...

At Rambus, we often receive RFIs, RFPs and RFQs for security silicon IP cores to be used in our customer’s next semiconductor ...

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, ...

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...

To tackle these reliability challenges, IC designers are increasingly embracing a “shift-left” mindset, where reliability ...

A technical paper titled “Roadmap for Schottky barrier transistors” was published by researchers at University of Surrey, ...

Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and ...

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still ...

Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...