Major technology updates include the world's first 8.5kW power supply for AI and hyperscale data centres, using high-power GaNSafe power ICs and Gen-3 Fast SiC MOSFETs.
Infineon Technologies AG announced it has unveiled an advance in handling and processing "the thinnest silicon power wafers ever manufactured," with a thickness of 20 micrometers and a diameter of 300 ...
This innovation will significantly help increase energy efficiency, power density and reliability in power conversion solutions for applications in AI data centers.