IPC Builds (formerly SummerCom), taking place from October 5-10, 2024, at the McKimmon Center in Raleigh, North Carolina. IPC Builds focuses on IPC standards development committee meetings and ...
Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as ...
PIXUS TECHNOLOGIES 3U OpenVPX backplanes in 1-slot size comes in various formats. This includes versions that are VPX only, and designs with VITA 67.3c, VITA 67.3d, and VITA 66.4 cutouts for RF and ...