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eeworldonline
21 小时
What joining methods optimize EV battery production efficiency? part 4
Mechanical assembly and soldering processes are used in EV battery production and different joining methods for building ...
eeworldonline
24 年
Design challenges for solar photovoltaic arrays operating in partially shaded environments
The challenges power electronics engineers overcome to maximize power extraction from partially shaded solar photovoltaic (PV ...
eeworldonline
24 年
What are the different types of AI accelerators?
Find out how AI accelerators revolutionize computing by overcoming the challenges of classic von Neumann architecture.
eeworldonline
3 天
How does a zero trust security architecture work?
Zero trust architectures (ZTAs) are a reaction to the emergence of cloud computing, remote work, and bringing your own device ...
eeworldonline
4 天
TDK’s ultrasonic time-of-flight sensor enhances sensing range and accuracy for smart home ...
TDK Corporation is presenting in its CES 2025 Booth #15815 how TDK MEMS sensors and solutions enable innovation in ...
eeworldonline
4 天
Power controller handles high-current AI systems to OpenVReg16 specifications
Alpha and Omega Semiconductor Limited unveiled its AOZ73016QI, a 16-phase, 2-rail controller specifically designed to the ...
eeworldonline
4 天
Energy harvesting PMIC family reduces circuit board space with inductor-less design
Nexperia is expanding its energy harvesting portfolio with the NEH71x0 power management IC (PMIC) family. This advanced PMIC ...
eeworldonline
4 天
Arm MCU pairs with DSP core for vehicle audio and sensing
Texas Instruments released new automotive chips focused on in-cabin sensing and audio processing. The AWRL6844 60GHz ...
eeworldonline
4 天
Mid-range power factor chokes deliver 260-4500 uH inductance range
ITG Electronics has further expanded its range of mid-tier power factor correction chokes (PFCs) providing premium ...
eeworldonline
4 天
Test wireless signal to 110 GHz with this 1-mm cable
Pasternack has announced the launch of its new 1.0mm test cable assemblies. These cables deliver exceptional performance in ...
eeworldonline
4 天
12 nm silicon IP integrates multi-standard connectivity
Ceva, Inc. unveiled the Ceva-Waves Links200, the first turnkey multi-protocol platform IP to support next-generation ...
eeworldonline
4 天
Industrial motherboards support DDR5, PCIe Gen 5, and USB4
ASRock Industrial unveils its newest range of industrial motherboards, powered by Intel Core Ultra 200S Processors (Arrow ...
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