Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, ...

Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...

Altera revealed new details on its next-generation, power- and cost-optimized Agilex 3 FPGAs and announced new development kits and software support for its Agilex 5 FPGAs. “Working closely with our ...

Mitsubishi announced that all success criteria, including an additional success, were achieved without performance degradation during a six-month on-orbit demonstration of its laser source module ...

Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass production of QLC 9th-generation ...

Intel and Amazon Web Services (AWS) announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel. This is a significant ...

Yole reported that the advanced IC substrate market currently dominated by organic core substrates, saw revenue decline in 2023, marking a year of correction. Further findings shared by Yole includes: ...

Littelfuse launched the IX4341 and IX4342 dual 5 ampere low-side MOSFET gate drivers. These gate drivers are specifically designed for driving MOSFETs and complete the existing IX434x driver series by ...

Navitas Semiconductor announced the release of a portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages. Navitas’ ...

Qualcomm expanded its Snapdragon X Series portfolio with the introduction of Snapdragon X Plus 8-core, a breakthrough platform that unleashes multiday battery life, unprecedented performance and ...

Everspin Technologies announced a strategic award to develop a long-term plan to provide manufacturing services for aerospace and defense segments. Under the award, Everspin will provide a plan to ...

5G RedCap was finalized in the 3GPP’s Release 17 to provide device OEMs with a migration pathway from 4G LTE to 5G for mid-range devices, whose throughput requirements sit between those of enhanced ...