Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.

美国最大的记忆体晶片制造商美光科技（Micron Technology）扩大新加坡制造产能，斥资70亿美元（约95亿新元）兴建本地首个高带宽存储器先进封装厂，生产人工智能所需的先进半导体产品，有助巩固新加坡在人工智能领域和更广泛的半导体生态系统发展。

MICRON Technology on Wednesday (Jan 8) broke ground in Woodlands for an advanced packaging facility for its high-bandwidth memory (HBM) semiconductor chip. Read more at The Business Times.

Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's ...